PVD-engineering

B17
HD 550-550-MK3

B18
HD 550-1250-MK3

B21
HD 850-1250-MK3

technical data

vacuum chamber

1000 x 1000 x 1150 mm

1000 x 1000 x 2050 mm

1300 x 1300 x 2050 mm

working volume

dia. 550 x 550 mm

dia. 550 x 1250 mm

dia. 850 x 1250 mm

vacuum pumps

1 unit including
2 turbomolecular,
1 roots and 2 rotary valve

2 units each including
2 turbomolecular,
1 roots and 2 rotary valve

2 units each including
3 turbomolecular,
1 roots and 3 rotary valve

substrate heaters

none

2 (optional)

plasma sources

DC ion beam, dia. up to 300 mm each

ion beam units

2

4

sputtering sources

3 permanent DC magnetron cathodes

target units

3 x (640 x 300 mm)

3 x (1465 x 350 mm)

shutter

3

4

substrate holders

4/6/8/10/12 spindles (optional)

4/6/8/10/12/16/20 spindles (optional)

substrate handling

wheel carriage
(manual)

wheel carriage
(hydraulic)

wheel carriage on rail

part flow

linear by 2 chamber openings (optional)

performance data

ultimate vacuum

< 5 x 10^-5 mbar

working pressure

1 to 3 x 10^-3 mbar

plasma sources

2 x 3000 Watt DC, bipolar;
electron/ ion bombardment

4 x 3000 Watt DC, bipolar;
electron/ ion bombardment

sputtering sources

3 x 10-20 kW

3 x 20-50 kW

substrate bias

3000 Watt DC / pulse operation

overall runtime

25 to 90 minutes

operating system

hardware

double PC controlling system;
fieldbus component control

software source

hartec^® application, windows^® multilanguage

operating system

secured access to processing data sets and parameters;
macro based multi step processing

operation

user definition of operator levels;
easy operating production process (start-stop)

display

19" touch screen

reporting

batch quality control report, automatic process data reporting;
user definition for trend recording, statistic- and graphic output facility

special software

component lifetime management, PVD process development

remote access

VPN / LAN, DSL

network facility

multi-machine network technology for worldwide processing;
remote data transfer

other

several technical options available on request

equipment specification

equipment size

3.6 x 1.6 x 2.2 m

4.8 x 1.8 x 2.9 m

5.9 x 2.1 x 2.9 m

operating area

6 x 4 m

8 x 5 m

10 x 6 m

room air quality

clean room grade "positive air"; 20 to 25°C; humidity rel. 50% (max.)

cooling system

dest. water; 20-24°C;
6 m³/h; 2.5 bar; 30 kW
(optional)

dest. water; 20-24°C;
13 m³/h; 2.5 bar; 65 kW
(optional)

dest. water; 20-24°C;
16 m³/h; 2.5 bar; 85 kW
(optional)

compressed air

oil and water-free; 7 bar; low consumption

process data

substrate heating

electron bombardment

electron bombardment and IR (optional)

plasma treatment

ion bombardment, pulse operation;
reactive process (N₂; C₂H₂, CO₂; O₂ or other)

metallization

single multilayer or nanolayer; metallic or metal-ceramic;
hardcoatings

target materials

Al, Cr, Cu, Mo, SS, Ti, Zr and other metals or alloys

product data

substrates

PC, ABS, ABS/PC, PBT, PC/PBT, PET, PA, PAA, PEEK, PF, PI, LCP,
ASA, SAN, PS, HDPE, PE/UHM, TPE, TPU, PVC, etc.
silicone rubber, aluminium, stainless steel, glass, ceramic

application

direct metallization, metallization on UV and conventional Primer;
metallization on electroplated surfaces

PVD coatings

decorative and functional; selective metallization; EMI-shielding;
translux^® and NCVM

properties

decorative coloring, conductive or non-conductive,
color stability and high coating thickness precision;
chemical resistant, wear resistant, environmental friendly

colors

aluminium, chrome, steel and titanium; anthracite in grey to black;
copper and brown grades; blue grades; champagne and yellow grades;
other customized solutions